By Allyson L. Hartzell
Successfully bringing MEMS-based items to marketplace hinges on engineering the portion of have enough reliability for the meant program, but the reliability and qualification method for MEMS established items isn't really generally understood. businesses that experience a deep knowing of MEMS reliability due to particular excessive quantity production adventure quite often view the main points of a reliability software as a aggressive virtue and are reluctant to percentage it. MEMS Reliability makes a speciality of the reliability and manufacturability of MEMS at a primary product engineering point by way of addressing procedure improvement and characterization, fabric estate characterization, failure mechanisms and physics of failure (PoF), sped up trying out and lifelong prediction, layout techniques for bettering yield, layout for reliability (DfR), packaging and checking out. Drawing upon years of sensible adventure and utilizing a variety of examples and illustrative functions, Allyson Hartzell, Mark da Silva, and Herbert Shea cover:
• tips to layout & manufacture MEMS elements for reliability by means of targeting simple instruments resembling reliability facts, CAD methodologies, FMEA, instruments & tools for failure research, and product improvement methodologies.
• the different sorts of failure modes for silicon and metal-based MEMS, together with mess ups originating within the layout and production stages, and in-use mess ups (electrical, mechanical, and environmental) and the way to prevent them.
• The checking out and qualification approaches for MEMS reliability and the explicit try protocols for accelerating particular MEMS- mess ups, resulting in stronger reliability knowing and actual lifetime prediction.
MEMS Reliability should be of curiosity to engineers,researchers, and product managers concerned about the construction and improvement, of MEMS who are looking to examine extra approximately deciding on and bettering product reliability and enforcing such practices inside their very own organizations.
"The MEMS Reference Shelf is a chain dedicated to Micro-Electro-Mechanical structures (MEMS), which mix mechanical, electric, optical, or fluidic parts on a typical microfabricated substrate to create sensors, actuators, and microsystems. This sequence, authored via prime MEMS practitioners, strives to supply a framework the place simple rules, identified methodologies, and new purposes are built-in in a coherent and constant manner."
STEPHEN D. SENTURIA Massachusetts Institute of know-how, Professor of electric Engineering, Emeritus
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Additional info for MEMS Reliability
31 Top view of a MEMtronics Corp RF capacitive MEMS air-gap switch on glass substrate. The membrane is the hour-glass shaped feature. The horizontal central conductor carries both the RF signal and the DC actuation voltage. Reprinted with permission. Copyright 2008 Society of Photo Optical Instrumentation Engineers  36 2 Lifetime Prediction Fig. 32 Schematic representation of switch capacitance vs. DC voltage, showing pull-in voltage Vpi , pull-out voltage Vpo , and the hysteresis in operation (which allows using a “hold” voltage much lower than the switching voltage) providing a much greater capacitance Con .
New York: Van Nostrand Reinhold. 4. Dodson, B. (2006) The Weibull Analysis Handbook, 2nd edn. Milwaukee: American Society for Quality, Quality Press. 5. M. et al. (2000) MEMS Reliability: Infrastructure, Test Structures, Experiments, and Failure Modes. Sandia Report SAND2000-0091, p. gov) 6. Courtesy of Sandia National Laboratories. html 7. R. (2006) Reliability of MEMS for space applications. In V. M. Tanner, R. Ramesham (eds) Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS.
The center conductor carries both the RF signal and the DC actuation voltage. When no voltage is applied the membrane remains in the up position, providing a small capacitance Coff from the signal line to ground. When a sufficiently high voltage DC is applied to the signal line, the membrane collapses on the dielectric, Fig. 30 schematic cross-section of a capacitive RF MEMS switch, top: undeflected (no dc bias), capacitance Coff , bottom: snapped down (bias voltage larger than Vpull-in ), larger capacitance Con Fig.
MEMS Reliability by Allyson L. Hartzell