Integrated Passive Component Technology by Richard K. Ulrich, Leonard W. Schaper PDF

By Richard K. Ulrich, Leonard W. Schaper

ISBN-10: 0471244317

ISBN-13: 9780471244318

ISBN-10: 0471722936

ISBN-13: 9780471722939

  • This is an intensive survey of the cutting-edge in built-in Passive part know-how.
  • Describes the techniques to be had for growing built-in passives, measuring their homes, and making use of them.
  • Brings reader brand new in a fast-moving know-how.
  • Enables reader to enforce the expertise right into a production setting.
  • Covers current and capability applied sciences for varied substrate platforms reminiscent of FR4, ceramic, and HDI.
  • Describes purposes favorable to built-in passives and the commercial tradeoffs linked to their implementation.

Content:
Chapter 1 advent (pages 1–32): Richard okay. Ulrich
Chapter 2 features and function of Planar Resistors (pages 33–54): Richard okay. Ulrich
Chapter three built-in Resistor fabrics and techniques (pages 55–74): Richard ok. Ulrich
Chapter four Dielectric fabrics for built-in Capacitors (pages 75–99): Richard ok. Ulrich
Chapter five dimension and Configuration of built-in Capacitors (pages 101–111): Richard ok. Ulrich
Chapter 6 Processing built-in Capacitors (pages 113–144): Richard okay. Ulrich
Chapter 7 Defects and Yield matters (pages 145–151): Richard okay. Ulrich
Chapter eight electric functionality of built-in Capacitors (pages 153–176): Richard ok. Ulrich and Leonard W. Schaper
Chapter nine Decoupling (pages 177–190): Leonard W. Schaper
Chapter 10 built-in Inductors (pages 191–245): Geert J. Carchon and Walter De Raedt
Chapter eleven Modeling of built-in Inductors and Resistors for Microwave functions (pages 247–291): Zhenwen Wang, M. Jamal Deen and A. H. Rahal
Chapter 12 different purposes and Integration applied sciences (pages 293–325): Elizabeth Logan, Geert J. Carchon, Walter De Raedt, Richard okay. Ulrich and Leonard W. Schaper
Chapter thirteen The Economics of Embedded Passives (pages 327–359): Peter A. Sandborn
Chapter 14 the way forward for built-in Passives (pages 361–371): Richard ok. Ulrich

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Read e-book online Integrated Passive Component Technology PDF

This can be a thorough survey of the state of the art in built-in Passive part know-how. Describes the procedures to be had for developing built-in passives, measuring their homes, and employing them. Brings reader brand new in a fast-moving know-how. allows reader to enforce the know-how right into a production setting.

Additional resources for Integrated Passive Component Technology

Sample text

No generalized models exist to aid the manufacturer. This sounds like a chicken-and-egg problem, but it can be solved by first assuming a specific and feasible material and process set for the existing manufacturing infrastructure and for the potential product, and then performing the costing based on that [16–19]. What is the impact of passive integration on an existing board design that utilizes surface mounts? 8 APPLICATIONS FOR INTEGRATED PASSIVES 23 increase due to the need to accommodate subsurface passives.

Evaluating the Need for Integrated Passive Substrates,” Advancing Microelectronics, 26, 1, 12, Jan/Feb 1999. 10. C. , McGraw-Hill, p. 17, 2001. 11. W. ), Advanced Electronic Packaging, IEEE Press, 1999. 12. M. , “Demonstration of Integral Passives on Double Sided Polyimide Flex,” In Proceedings of the 2000 International Conference on High-Density Interconnect and Systems Packaging, p. 351, 2000. 13. M. Thakre, Integral Planar Inductors. MS thesis, Dept. of Chemical Engineering, University of Arkansas, December 2000.

9, 2001. 7. D. , “Integrated Thin Film Capacitor Arrays,” In Proceedings of the International Conference and Exhibition on High Density Packaging and MCMs, IMAPS, p. 431, 1999. 8. J. htm, 2001. 9. H. , “Evaluating the Need for Integrated Passive Substrates,” Advancing Microelectronics, 26, 1, 12, Jan/Feb 1999. 10. C. , McGraw-Hill, p. 17, 2001. 11. W. ), Advanced Electronic Packaging, IEEE Press, 1999. 12. M. , “Demonstration of Integral Passives on Double Sided Polyimide Flex,” In Proceedings of the 2000 International Conference on High-Density Interconnect and Systems Packaging, p.

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