New PDF release: Fundamentals of Microsystems Packaging

By Rao Tummala

ISBN-10: 0071371699

ISBN-13: 9780071371698

The single booklet to coach microsystems packaging-written by means of the field's prime authorThis is the booklet that engineers, technicians, and scholars want-the first to coach microsystems packaging from the floor up. Rao Tummala's one-stop basics to Microsystems Packaging covers the sphere from wafer to platforms, together with each significant contributing know-how. it is the merely booklet to take action. This much-needed device features:*A accomplished educational masking each significant element of microelectronics, photonics, RF, packaging layout, meeting, reliability, checking out, production and its relevance to either semiconductors and systems.*Rigorous assurance of electric, mechanical, chemical, and fabrics facets of every technology*Easy-to-read schematics and block diagrams*Fundamental techniques to all method issues*Examples of all universal configurations and technologies-wafer point packaging, unmarried chip, multichip, RF, opto-electronic, microvia forums, thermal and others*Details on chip-to-board connections, sealing and encapsulation, and production processes*Basics of electric and reliability testing*Hundreds of explanatory two-color illustrations*Self-test difficulties and ideas in each chapter*Glossary*The top technique to research microsystems packaging via self-study or in a classroom-and the main finished on-the-job reference

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Another major advance in high-speed trains did not occur until 1981, when the French National Railroads began running the Train a Grande Vitesse between Paris and Lyon. These electrified trains, each a permanent combination of passenger cars between two locomotives, attained 270 km/h and increased to 300 km/h at the end of the decade. Robert Moog offered an electronic music synthesizer. Five years later, jazz pianist Paul Bley gave a live performance on one. IBM announced the System 360, the first compatible ‘‘family’’ of computers.

J. Madou. Fundamentals of Microfabrication. Boca Raton: CRC Press, 1997, 589. 17. D. , eds. Thin Film Multichip Modules. New Jersey: IEEE Press, 1993. 18. E. Peeters. ’’ IEEE Computer Science Engineering. Jan–Mar 1997. 19. K. Peterson. ’’ Proceedings, IEEE. Vol. 70, No. 5, 1982, 420–457. 20. B. Razavi, RF Microelectronics. Prentice Hall, 1998. 21. D. E. Ricken, and W. Gessner. Advanced Microsystems for Automotive Applications ’98. New York: Springer, 1998. 22. B. F. Romanowicz. Methodology for the Modeling and Simulation of Microsystems.

32. W. Wolf, Modern VLSI Design. Prentice Hall, 1998. 33. Lau, Wong, et al. Electronic Packaging: Design, Materials, Process, and Reliability. New York: McGraw-Hill, 1998. ACKNOWLEDGMENT The editor gratefully acknowledges the contribution of Dr. Don Estreich of Agilent Technologies for critically reviewing this chapter. com) Copyright © 2004 The McGraw-Hill Companies. All rights reserved. Any use is subject to the Terms of Use as given at the website. com) Copyright © 2004 The McGraw-Hill Companies.

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Fundamentals of Microsystems Packaging by Rao Tummala


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