Read e-book online Electromigration in Thin Films and Electronic Devices: PDF

By Choong-Un Kim

ISBN-10: 1845699378

ISBN-13: 9781845699376

 Understanding and proscribing electromigration in skinny motion pictures is vital to the continuing improvement of complex copper interconnects for built-in circuits. Electromigration in skinny motion pictures and digital units offers an updated evaluation of key issues during this commercially vital region. half one contains 3 introductory chapters, masking modeling of electromigration phenomena, modeling electromigration utilizing the peridynamics technique and simulation and x-ray microbeam experiences of electromigration. half bargains with electromigration matters in copper interconnects, together with x-ray microbeam research, voiding, microstructural evolution and electromigration failure. ultimately, half 3 covers electromigration in solder, with chapters discussing subject matters reminiscent of electromigration-induced microstructural evolution and electromigration in flip-chip solder joints.

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78 (1995) 900–4. A. Korhonen, P. N. -Y. Li, Stress evolution due to electromigration in thin film, J. Appl. Phys. 73 (1993) 3790–9. S. C. Jaeger, Conduction of heat in solids, Oxford, UK: Clarendon, 1947. L. S. P. V. Thompson, Electromigration-induced extrusion failures in Cu/low-k interconnects, J. Appl. Phys. 103 (2008) 023529. 22 J. He, Z. N. A. Maiz, Electromigration lifetime and critical void volume, Appl. Phys. Lett. 85 (2004) 4639–3. 23 X. Dong, P. Zhu, Z. Li, J. D. Boyd, Electromigration-induced stress in a confined bamboo interconnect with randomly distributed grain sizes, Microelectron.

Bhate, A. F. Bower, Diffuse interface model for electromigration and stress voiding, J. Appl. Phys. 87(4) (2000) 1712–21. M. Schimschak, J. Krug, Surface electromigration as a moving boundary value problem, Phys. Rev. Lett. 78 (1997) 278–81. R. Gungor, D. Maroudas, Theoretical analysis of electromigration-induced failure of metallic thin films due to transgranular void propagation, J. Appl. Phys. 85(4) (1999) 2233–46. R. Gungor, D. Maroudas, Electromigration-induced failure of metallic thin films due to transgranular void propagation, Appl.

Davis, A stochastic wire-length distribution for gigascale integration, IEEE Trans. Electron Devices 45(3) (1998) 580–89. M. Tan, A. Roy, Electromigration in ULSI interconnects, Mater. Sci. Eng. R 58 (2007) 1–75. 32 D. W. Zaage, Three-dimensional voids simulation in chip metallization structures: a contribution to reliability evaluation, Microelectron. Reliab. 41 (2001) 1625–30. M. Tan, A. Roy, Investigation of the effect of temperature and stress gradients on accelerated EM test for Cu narrow interconnects, Thin Solid Films 504 (2006) 288–93.

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Electromigration in Thin Films and Electronic Devices: Materials and Reliability by Choong-Un Kim

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