By Choong-Un Kim
Understanding and proscribing electromigration in skinny motion pictures is vital to the continuing improvement of complex copper interconnects for built-in circuits. Electromigration in skinny motion pictures and digital units offers an updated evaluation of key issues during this commercially vital region. half one contains 3 introductory chapters, masking modeling of electromigration phenomena, modeling electromigration utilizing the peridynamics technique and simulation and x-ray microbeam experiences of electromigration. half bargains with electromigration matters in copper interconnects, together with x-ray microbeam research, voiding, microstructural evolution and electromigration failure. ultimately, half 3 covers electromigration in solder, with chapters discussing subject matters reminiscent of electromigration-induced microstructural evolution and electromigration in flip-chip solder joints.
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Extra resources for Electromigration in Thin Films and Electronic Devices: Materials and Reliability
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Electromigration in Thin Films and Electronic Devices: Materials and Reliability by Choong-Un Kim