By Yi (Grace) Li, Daniel Lu, C.P. Wong
Electrical Conductive Adhesives with Nanotechnologies starts off with an outline of digital packaging, discussing some of the electric adhesive recommendations at present to be had. The e-book focuses broadly on Electrically Conductive Adhesives (ECAs), in addition to different adhesives similar to lead-free soldering, Isotropically Conductive Adhesives (ICAs), Anisotropically Conductive Adhesives/Films (ACA/ACFs) and Nonconductive Adhesives/Films (NCA/NCFs). The authors additionally current examples of ways conductive adhesives could be utilized to nano options, whereas making very important mentions of modern learn and improvement breakthroughs within the fields.
Drawing upon tireless examine, years of theoretical improvement and functional event, and using a number of visible examples and illustrative functions, authors CP Wong, Yi Li and Daniel Lu conceal electrically conductive adhesives intensive, whereas additionally describing:
- The electric homes, thermal functionality, bonding strain, meeting and reliability of diverse different types of electrically conductive adhesives
- The similarities and variations among lead-free soldering recommendations and electrically conductive adhesives, whereas additionally discussing the benefits of ECAs.
- Insights into the way forward for nano ECAs, in addition to projections of destiny tendencies.
Electrical Conductive Adhesives with Nanotechnologies is a must-read for either researchers and lively engineers within the digital packaging box.
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Additional resources for Electrical Conductive Adhesives with Nanotechnologies
15] used laser irradiation of silver–gold colloidal mixture to synthesize Ag/Au alloy nanoparticles. The other method is the successive reduction of two-metal salts, which is usually carried out to prepare a core–shell structure of bimetallic nanoparticles. Mandal et al.  used seed-mediated techniques to synthesize core-shell type Ag/Au bimetallic nanoparticles. For the physical method, nanoparticles can be made directly from the bulk materials. Compared to the chemical reduction method, the physical method renders higher yield.
Lo and S. K. Sitaraman, “G-Helix: Lithography-Based, WaferLevel Compliant Chip-to-Substrate Interconnect,” Proceedings 20            1 Introduction 54th Electronic Components and Technology Conference, Las Vegas, Nevada, June 1–4, pp. 320–325, 2004. D. B. Tuckerman, D. J. Ashkenas, E. Schmidt, and C. Smith, “Die Attach and Interconnection Technology for Hybrid WSI,” Laser Pantography States Report UCAR, Lawrence Livermore Laboratories, pp. 10195, 1986. D. J.
30 2 Nanotechnology PWB surface electrical interconnect is achievable by screen or “ink-jet” printing of nanoscale metal colloids in suspension [45–48]. As above, electrical continuity is established by sintering Ag nanoparticles [49–52], which can also be used for die attach. Fused silica fillers are added to flip chip underfills to reduce the coefficient of thermal expansion, and nanoparticles resist settling better  and scatter light less than larger fillers, permitting UV optical curing  and other advantages of optical transparency .
Electrical Conductive Adhesives with Nanotechnologies by Yi (Grace) Li, Daniel Lu, C.P. Wong