Yi (Grace) Li, Daniel Lu, C.P. Wong's Electrical Conductive Adhesives with Nanotechnologies PDF

By Yi (Grace) Li, Daniel Lu, C.P. Wong

ISBN-10: 0387887822

ISBN-13: 9780387887821

Electrical Conductive Adhesives with Nanotechnologies starts off with an outline of digital packaging, discussing some of the electric adhesive recommendations at present to be had. The e-book focuses broadly on Electrically Conductive Adhesives (ECAs), in addition to different adhesives similar to lead-free soldering, Isotropically Conductive Adhesives (ICAs), Anisotropically Conductive Adhesives/Films (ACA/ACFs) and Nonconductive Adhesives/Films (NCA/NCFs). The authors additionally current examples of ways conductive adhesives could be utilized to nano options, whereas making very important mentions of modern learn and improvement breakthroughs within the fields.

Drawing upon tireless examine, years of theoretical improvement and functional event, and using a number of visible examples and illustrative functions, authors CP Wong, Yi Li and Daniel Lu conceal electrically conductive adhesives intensive, whereas additionally describing:

  • The electric homes, thermal functionality, bonding strain, meeting and reliability of diverse different types of electrically conductive adhesives
  • The similarities and variations among lead-free soldering recommendations and electrically conductive adhesives, whereas additionally discussing the benefits of ECAs.
  • Insights into the way forward for nano ECAs, in addition to projections of destiny tendencies.

Electrical Conductive Adhesives with Nanotechnologies is a must-read for either researchers and lively engineers within the digital packaging box.

Show description

Read Online or Download Electrical Conductive Adhesives with Nanotechnologies PDF

Best microelectronics books

Read e-book online Nanophysics and nanotechnology: introduction to modern PDF

Delivering the 1st self-contained creation to the actual recommendations, strategies and functions of nanotechnology, this is often of curiosity to readers grounded in collage chemistry and physics. As such, it truly is appropriate for college kids and pros of engineering, technology, and fabrics technological know-how and to investigate staff of assorted backgrounds within the interdisciplinary parts that make up nanotechnology.

Nanoscale transistors: Device Physics, Modeling and - download pdf or read online

The continual scaling of transistors within the final half century has been the driver for electronics. The channel size of the transistors in construction at the present time is under 100nm. a large choice of units also are being explored to enrich or maybe exchange silicon transistors at molecular scales.

Download PDF by Jürgen Valldorf, Wolfgang Gessner: Advanced Microsystems for Automotive Applications 2007

In retrospect whilst the overseas discussion board on complicated Microsystems for car program (AMAA) begun, huge, immense development has been made in lowering casualties, emissions and in expanding convenience and function. Microsystems in lots of circumstances supplied the main capabilities for this development. even though the problems the development focused on didn’t switch considerably (safety, powertrain, convenience, and so on.

Download PDF by Richard K. Ulrich, Leonard W. Schaper: Integrated Passive Component Technology

It is a thorough survey of the cutting-edge in built-in Passive part know-how. Describes the tactics on hand for growing built-in passives, measuring their houses, and making use of them. Brings reader brand new in a fast-moving know-how. allows reader to enforce the know-how right into a production surroundings.

Additional resources for Electrical Conductive Adhesives with Nanotechnologies

Sample text

15] used laser irradiation of silver–gold colloidal mixture to synthesize Ag/Au alloy nanoparticles. The other method is the successive reduction of two-metal salts, which is usually carried out to prepare a core–shell structure of bimetallic nanoparticles. Mandal et al. [16] used seed-mediated techniques to synthesize core-shell type Ag/Au bimetallic nanoparticles. For the physical method, nanoparticles can be made directly from the bulk materials. Compared to the chemical reduction method, the physical method renders higher yield.

Lo and S. K. Sitaraman, “G-Helix: Lithography-Based, WaferLevel Compliant Chip-to-Substrate Interconnect,” Proceedings 20 [4] [5] [6] [7] [8] [9] [10] [11] [12] [13] [14] 1 Introduction 54th Electronic Components and Technology Conference, Las Vegas, Nevada, June 1–4, pp. 320–325, 2004. D. B. Tuckerman, D. J. Ashkenas, E. Schmidt, and C. Smith, “Die Attach and Interconnection Technology for Hybrid WSI,” Laser Pantography States Report UCAR, Lawrence Livermore Laboratories, pp. 10195, 1986. D. J.

30 2 Nanotechnology PWB surface electrical interconnect is achievable by screen or “ink-jet” printing of nanoscale metal colloids in suspension [45–48]. As above, electrical continuity is established by sintering Ag nanoparticles [49–52], which can also be used for die attach. Fused silica fillers are added to flip chip underfills to reduce the coefficient of thermal expansion, and nanoparticles resist settling better [53] and scatter light less than larger fillers, permitting UV optical curing [54] and other advantages of optical transparency [55].

Download PDF sample

Electrical Conductive Adhesives with Nanotechnologies by Yi (Grace) Li, Daniel Lu, C.P. Wong

by Jason

Rated 4.64 of 5 – based on 34 votes